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PIM252010S4R7M

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2520系列
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产品描述

Features

● Low Rdc.uH in this package size

●High Saturation Current

●High strength and corrosion resistance

●100% lead (Pb) free meet RoHS standard

●Measuring frequency 1MHz

 

Application

●DC/DC converters.

● Notebook/Desktop/Server applications. 

● Battery powered devices.

● LCD displays, HDDs, DVCs, DSCs, PDAs etc

●Pad、Smart phone、Drive、Smart watch、Smart glass

●Baseband power supply, Amplifier, Power management, Module power supply, Camera power management

 

Specifications

PIM252010S(2.5*2.0*1.0mm)

P/N

L0(µH)
@ (0A) 1MHz

Rdc(mΩ)

Heat rating current Irms ( A )

Saturation current
Isat ( A )

Typical

Max

Typical

Max

  Typical

Max

PIM252010SR24M

0.24

12

17.5

6.7

6.4

8.5

7.8

PIM252010SR33M

0.33

13

19

6.5

6.2

7.6

7.2

PIM252010SR47M

0.47

15

22

6.1

5.6

6.9

6.5

PIM252010SR68M

0.68

23

27

5.6

5.0

5.9

5.5

PIM252010S1R0M

1.0

25

30

4.5

4.1

5.3

4.8

PIM252010S1R5M

1.5

45

55

3.4

3.0

4.3

3.9

PIM252010S2R2M

2.2

62

70

2.4

2.1

3.3

3.0

PIM252010S3R3M

3.3

86

100

2.5

2.1

2.8

2.5

PIM252010S4R7M

4.7

160

180

2.0

1.6

2.6

2.0

PIM252010S100M

10.0

500

560

1.05

0.95

1.55

1.4

 

Product Characteristics

Item

要求
Requirements

试验方法及备注
Test Methods and Remarks

绝缘电阻
Insulation Resistance

≥100MΩ

在电感器线圈和本体顶面中间施加
100 V 直流电压保持 60 s。
100 V DC between inductor coil and The
middle of the top surface of the body for 60 seconds.

可焊性
Solderability

电极面 90%以上覆盖新的焊料。
90% or more of electrode area shall
be coated by new solder.

在(245±5) ℃熔融的焊锡
(96.5Sn/3.0Ag/0.5Cu)中浸(5±1) s。
Dip pads in flux and dip in solder pot
(96.5Sn/3.0Ag/0.5Cu) at (245±5) ℃ for (5±1) seconds.

耐焊接热
Resistance to Soldering Heat

外观无可见机械损伤;
电感量变化率:±10%以内。
No visible mechanical damage.
Inductance change: Within ±10%

在(260±5) ℃熔融的焊锡(96.5Sn/3.0Ag/0.5Cu)中浸 (10±1) s。
Dip pads in flux and dip in solder pot(96.5Sn/3.0Ag/0.5Cu) at (260±5) ℃ for (10±1) seconds.

端子强度
Adhesion of terminal
electrode

元件的端子与本体结合无松动、无脱落。
Strong bond between the pad and
the core, without come off PC board.

将电感器用(260±5) ℃,(20±5) s 焊在带有 0.3 mm 厚锡膏的基板上,
然后用冶具垂直电极面方向加压 10 N,(10±1) s。
Inductors shall be subjected to (260±5)℃ for (20±5) s Soldering in the base whit 0.3mm solder.
And then aplomb electrode way plus tax 10 N for (10±1) seconds.

耐高温
High temperature

外观无可见机械损伤;
电感量变化率:±10%以内。
No visible mechanical damage.
Inductance change: Within ±10%

温度(+125 ± 2 )℃,时间(1000±2) h;
Temperature is (+125±2)℃ and keep (1000±2) hours.

耐低温
Low temperature

外观无可见机械损伤;
电感量变化率:±10%以内。
No visible mechanical damage.
Inductance change: Within ±10%

温度(-55℃ ±2) ℃,时间(1000±2) h;
Temperature is  (-55±2)℃ and keep (1000±2) hours.

温度变化
Thermal shock

外观无可见机械损伤;
电感量变 化率:±10%以内。
No visible mechanical damage.
Inductance change: Within ±10%

(-55±3) ℃,时间(30±3) min ↔ (125℃±2) ℃/(30±3) min,
转换时间(2~3) min,循环32次; 在室温下放置 2 小时后、48 ±4小时内测试。
The test sample shall be placed at (-55±3)℃ and
(125±2)℃ for (30±3) min, different temperature
conversion time is 2~3 minutes. The temperature
cycle shall be repeated 32 cycles. Placed at room
temperature for 2 hours, within 48 hours of testing.

温度特性
Temperature
characteristic


Within ±20%

a:+20 ℃ (30~45) min →
b: -40 ℃ (30~45) min  →
c: +20 ℃ (30~45) min →
d: +125 ℃ (30~45) min  →
e: +20 ℃ (30~45) min

恒定湿热
Static
Humidity

外观无可见机械损伤;
电感量变化率:±10%以内。
No visible mechanical damage.
Inductance change: Within ±10%

将电感器放置在于湿度(95±3)%RH,温度(60±2)℃ 的环境中存放(1000±4)h,
在室温下放置2小时后、 48小时内测试。
Inductors shall be subjected to (95±3)%RH . at
(60±2)℃ for (1000±4) h . Placed at room temperature
for 2 hours, within 48 hours of testing.

耐久性(寿命)
Life

外观无可见机械损伤;
电感量变化率:±10%以内。
No visible mechanical damage.
Inductance change: Within ±10%

温度(85 ±2)℃,时间(1000±4) h,施加 Irms,
在室温下放置2小时后、48小时内测试。
Inductors shall be store at (85±2)℃ for (1000±4) hours with Irms applied.
Placed at room temperature for 2 hours, within 48 hours of testing

 

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