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PIM160808SR47M

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浏览量:

1000

PIM160808SR47M

Application
●DC/DC converters.
● Notebook/Desktop/Server applications.
● Battery powered devices.
● LCD displays, HDDs, DVCs, DSCs, PDAs etc
●Pad、Smart phone、Drive、Smart watch、Smart glass
●Baseband power supply, Amplifier, Power management, Module power supply, Camera power management

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浏览量:

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产品编号

所属分类

1608系列

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产品描述

Features

● Low Rdc.uH in this package size

●High Saturation Current

●High strength and corrosion resistance

●100% lead (Pb) free meet RoHS standard

●Measuring frequency 1MHz

Application

●DC/DC converters.

● Notebook/Desktop/Server applications.

● Battery powered devices.

● LCD displays, HDDs, DVCs, DSCs, PDAs etc

●Pad、Smart phone、Drive、Smart watch、Smart glass

●Baseband power supply, Amplifier, Power management, Module power supply, Camera power management

Specifications

PIM160808S(1.6*0.8*0.8mm)

P/N	L0（µH） @ (0A) 1MHz	Rdc(mΩ）		Heat rating current Irms ( A )		Saturation current Isat ( A )
P/N	L0（µH） @ (0A) 1MHz	Typical	Max	Typical	Max	Typical	Max
PIM160808SR47M	0.47	80	100	2.6	2.3	4.1	3.7
PIM160808S1R0M	1.0	180	200	2.1	1.8	3.0	2.6

Product Characteristics

Item	要求 Requirements	试验方法及备注 Test Methods and Remarks
绝缘电阻 Insulation Resistance	≥100MΩ	在电感器线圈和本体顶面中间施加 100 V 直流电压保持 60 s。 100 V DC between inductor coil and The middle of the top surface of the body for 60 seconds.
可焊性 Solderability	电极面 90%以上覆盖新的焊料。 90% or more of electrode area shall be coated by new solder.	在(245±5) ℃熔融的焊锡（96.5Sn/3.0Ag/0.5Cu）中浸(5±1) s。 Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at (245±5) ℃ for (5±1) seconds.
耐焊接热 Resistance to Soldering Heat	外观无可见机械损伤；电感量变化率：±10%以内。 No visible mechanical damage. Inductance change: Within ±10%	在(260±5) ℃熔融的焊锡(96.5Sn/3.0Ag/0.5Cu)中浸 (10±1) s。 Dip pads in flux and dip in solder pot(96.5Sn/3.0Ag/0.5Cu) at (260±5) ℃ for (10±1) seconds.
端子强度 Adhesion of terminal electrode	元件的端子与本体结合无松动、无脱落。 Strong bond between the pad and the core, without come off PC board.	将电感器用(260±5) ℃，(20±5) s 焊在带有 0.3 mm 厚锡膏的基板上，然后用冶具垂直电极面方向加压 10 N，(10±1) s。 Inductors shall be subjected to (260±5)℃ for (20±5) s Soldering in the base whit 0.3mm solder. And then aplomb electrode way plus tax 10 N for (10±1) seconds.
耐高温 High temperature	外观无可见机械损伤；电感量变化率：±10%以内。 No visible mechanical damage. Inductance change: Within ±10%	温度(+125 ± 2 )℃,时间(1000±2) h； Temperature is (+125±2)℃ and keep (1000±2) hours.
耐低温 Low temperature	外观无可见机械损伤；电感量变化率：±10%以内。 No visible mechanical damage. Inductance change: Within ±10%	温度(-55℃ ±2) ℃，时间(1000±2) h； Temperature is (-55±2)℃ and keep (1000±2) hours.
温度变化 Thermal shock	外观无可见机械损伤；电感量变化率：±10%以内。 No visible mechanical damage. Inductance change: Within ±10%	(-55±3） ℃,时间(30±3) min ↔ (125℃±2) ℃/(30±3) min，转换时间(2~3) min,循环32次；在室温下放置 2 小时后、48 ±4小时内测试。 The test sample shall be placed at (-55±3)℃ and (125±2)℃ for (30±3) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 48 hours of testing.
温度特性 Temperature characteristic	Within ±20%	a：+20 ℃ （30~45） min → b: -40 ℃ （30~45） min → c: +20 ℃ （30~45） min → d: +125 ℃ （30~45） min → e: +20 ℃ （30~45） min ；
恒定湿热 Static Humidity	外观无可见机械损伤；电感量变化率：±10%以内。 No visible mechanical damage. Inductance change: Within ±10%	将电感器放置在于湿度(95±3)%RH,温度(60±2)℃ 的环境中存放(1000±4)h，在室温下放置2小时后、 48小时内测试。 Inductors shall be subjected to (95±3)%RH . at (60±2)℃ for (1000±4) h . Placed at room temperature for 2 hours, within 48 hours of testing.
耐久性(寿命) Life	外观无可见机械损伤；电感量变化率：±10%以内。 No visible mechanical damage. Inductance change: Within ±10%	温度(85 ±2)℃，时间(1000±4) h,施加 Irms，在室温下放置2小时后、48小时内测试。 Inductors shall be store at (85±2)℃ for (1000±4) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing